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Manafacture: AMD File size: 305.58 kb File name: Language of manual:

NOTICE SYMBOL Registered marks notice symbol. All product and product feature names is claiming trademark rights or for which application should “™” notice symbol. the Chipset Marketing to ensure you Logos and Text Treatment Using AMD CrossFireChipset Logos Use AMD CrossFireChipset logos when promoting motherboards or systems with these chipset. The logos must be used in the following applications: • On the heat sink for Northbridge. • On the PC boot up screen (BIOS Splash) • On retail packaging • Advertising and promotional material Logos and Text Treatment This logo is used on the Northbridge and or Southbridge on the Motherboard heat sink These logos are used on the PC boot up Screen (BIOS Splash), formotherboard packaging (see packaging guidelines for more details), advertisement, collateral material File name: _HS.epsLogo UseFile name: Splash Screen_BIOS.bmpPrint/Package_ PRINT.epsWeb/Electronic_GP Logos and Text Treatment Requirements for BIOS Splash Screen Logo The BIOS Splash screen logo must be placed either in the center of the monitor or the upper top left-hand corner of The logo must be no smaller than 2 inches The logo must be present for a minimum 2 inches Text Box: Packaging Guidelines Packaging GuidelinesSection 2 Packaging Guidelines These packaging standards have been developed to provide consistent brand recognition for the logo established for all AMD products, and to more clearly communicate the consumer benefits of AMD products. Please follow these guidelines for all motherboard packaging with the AMD CrossFirechipset product line. Packaging Guidelines Mandatory Box Layout Requirements:There is only one mandatory element for all partner The AMD CrossFireChipset product logo MUST be on the front and back panels of the retail box.This elements must be reproduced without variation in the positions identified. Partner artwork can then be placed in grey zones of the marked illustration below. Packaging Guidelines Other Mandatory Requirements: 1. The proportion of logo size to package area shown must be maintained (see below) 2. To ensure sufficient visibility, an unobstructed Chipset badge logo. 3. The ™ should be placed after CrossFire. The must always appear at least once. 4. Pantone color 347 is always used for AMD green. Pantone color always used for CrossFirered. 5. Partners must include the legal line on all packaging or other advertising materials any AMD logos or visual “AMD, the AMD Arrow Radeon, and combinations thereof are trademarks Devices, Inc. Other for informational owners.” Packaging Guidelines Logo Sizing Requirements 1. Logo must be 0.375” away from box edge and other logos. 2. The logo must be at least 2” wide. 2” 0.375” Packaging Guidelines Incorrect Use of Chipset Package Art Template 1. The chipset badge logo is not placed on the front/top side of the packaging 2. The badge is two small, not meeting the 2” wide criteria 3. Partners may not add unauthorized numeric after the Chipset technology brand name. e....

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