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manual abstract
However, the board also provides an internal 1 x 2 power connector that can be used in custom-developed systems that have a custom internal power supply. The internal 1 x 2 power connector is a Molex 5566-2 header which accepts a Molex 5557-02R connector from the power supply. There is no isolation circuitry between the external 19 V DC jack and the internal 1 x 2 power connector. It is the system integrator’s responsibility to ensure no more than one power supply unit is or can be attached to the board at any time and to ensure the external 19 V DC jack is covered if the internal 1 x 2 power connector is to be used. Simultaneous connection of both external and internal power supply units could result in potential damage to the board, power supplies, or other hardware. System power requirements will depend on actual system configurations chosen by the integrator, as well as end user expansion preferences. It is the system integrator’s responsibility to ensure an appropriate power budget for the system configuration is properly assessed based on the system-level components chosen. 2.6.2 Fan Header Current Capability Table 18 lists the current capability of the fan headers. Table 18. Fan Header Current Capability Fan Header Maximum Available Current Processor fan .1 A 2.7 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 58 oC at the processor fan inlet is a requirement. Whenever possible, use of a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area is recommended. CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. All responsibility for determining the adequacy of any thermal or system design remains solely with the system integrator. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8. CAUTION The processor voltage regulator area (shown in Figure 15) can reach a temperature of up to 97.5 oC in an open chassis. Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in shorter than expected product lifetime. Figure 15 shows the locations of the localized high temperature zones. Item Description A Processor voltage regulator area B Thermal solution Figure 15. Localized High Temperature Zones Table 19 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 19. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel QS77 Express Chipset 104 oC To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 20. This is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified as the maximum sustainable power to be dissipated by the components). When the component is dissipating less than TDP, the case temperature should be below the Maximum Case Temperature. The surface temperature at the geometric center of the component corresponds to Case Temperature. It is important to note that the temperature measurement in the system BIOS is a value reported by embedded thermal sensors in the components and does not directly correspond to the Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is Tcontrol. Table 20. Tcontrol Values for Components Component Tcontrol Processor For processor case temperature, see processor datasheets and processor specification updates Intel QS77 Express Chipset 104 oC For information about Refer to Processor datasheets and specification updates Section 1.2, page 18 Intel® 7 Series Chipset Thermal Mechanical Specifications and Design Guidelines Chipsets/ec-QS77/QS77- technicaldocuments.htm 2.8 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332 Issue 2, Method I, Case 3, 55 .C ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF for the board ...
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