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manual abstract
Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the indicated parameters of the ATX form factor specification. • The potential relation between 3.3 VDC and +5 VDC power rails • The current capability of the +5 VSB line • All timing parameters • All voltage tolerances For example, for a system consisting of a supported 65 W processor (see Section 1.3 on page 16 for a list of supported processors), 1 GB DDR3 RAM, one high end video card, one hard disk drive, one optical drive, and all board peripherals enabled, the minimum recommended power supply is 350 W. Table 28 lists the recommended power supply current values. Table 28. Recommended Power Supply Current Values Output Voltage 3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB Current 17 A 18 A 12 A 18 A 0.8 A 2 A For information about Refer to Selecting an appropriate power supply S-026472.htm Technical Reference 2.6.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 29 lists the current capability of the fan headers. Table 29. Fan Header Current Capability Fan Header Maximum Available Current Processor fan 2.0 A System fan 1.5 A 2.6.3 Add-in Board Considerations The board is designed to provide 2 A (average) of current for each add-in board from the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board (all expansion slots filled) must not exceed the system’s power supply +5 V maximum current. Intel Desktop Board DH61DL Technical Product Specification 2.7 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is required. Use of a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area is highly recommended. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION The ambient temperature must not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.9. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. Technical Reference Figure 16 shows the locations of the localized high temperature zones. Item Description A Processor voltage regulator area B Processor C Intel H61 Express Chipset Figure 16. Localized High Temperature Zones Table 30 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 30. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel H61 Express Chipset 111 oC (under bias) For information about Refer to Processor datasheets and specification updates Section 1.3, page 16 Intel Desktop Board DH61DL Technical Product Specification 2.8 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 .C ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 .C. The MTBF for the board is 292,467 hours. 2.9 Environmental Table 31 lists the environmental specifications for the board. Table 31. Environmental Specifications Parameter Specification Temperature Non-Operating -40 °C to +60 °C (Note) Operating 0 °C to +40 °C The operating temperature of the board may be determined by measuring the air temperature from within 1 inch of the edge of the chipset/PCH heatsink and 1 inch above the board, in a closed chassis, while the system is in operation. Shock Unpackaged 50 g trapezoidal waveform Velocity change ...